METHOD FOR MANUFACTURING A CIRCULAR WAFER BY POLISHING THE PERIPHERY, INCLUDING A NOTCH OR ORIENTATION FLAT, OF A WAFER COMPRISING CRYSTAL MATERIAL, BY USE OF POLISHING TAPE

摘要

Provided is a method for producing a circular wafer using a grinding tape to grind the edge of a wafer comprising a crystalline material. A primary grinding step is provided for contacting a grinding body to the peripheral portion of a wafer placed centered on a horizontal stage and rotating the stage, thus grinding the peripheral portion. The radius of the wafer is measured, and a radius is set that is no greater than the measured smallest radius, and the difference Δr between the set radius and the measured wafer radius along the peripheral portion is determined. The portions of the peripheral portion at which Δr is greater than a predetermined value are determined and a secondary grinding step is provided for contacting the peripheral portion and the grinding body, rotating the stage forwards and backwards in a predetermined range of rotational angles, and grinding the peripheral portion.