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Semiconductor component and method of triggering avalanche breakdown

机译:半导体元件和触发雪崩击穿的方法

摘要

A semiconductor component includes an auxiliary semiconductor device configured to emit radiation. The semiconductor component further includes a semiconductor device. An electrical coupling and an optical coupling between the auxiliary semiconductor device and the semiconductor device are configured to trigger emission of radiation by the auxiliary semiconductor device and to trigger avalanche breakdown in the semiconductor device by absorption of the radiation in the semiconductor device. The semiconductor device includes a pn junction between a first layer of a first conductivity type buried below a surface of a semiconductor body and a doped semiconductor region of a second conductivity type disposed between the surface and the first layer.
机译:半导体部件包括构造成发射辐射的辅助半导体器件。半导体部件还包括半导体器件。辅助半导体器件和半导体器件之间的电耦合和光耦合被配置为触发辅助半导体器件的辐射发射,并通过吸收半导体器件中的辐射来触发半导体器件中的雪崩击穿。半导体器件包括掩埋在半导体本体的表面下方的第一导电类型的第一层与设置在该表面和第一层之间的第二导电类型的掺杂的半导体区域之间的pn结。

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