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BREAKDOWN PHENOMENA IN SEMICONDUCTORS AND SEMICONDUCTOR DEVICES: Static Avalanche Breakdown

机译:半导体和半导体设备中的故障现象:静态雪崩击穿

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摘要

Systematic studies of breakdown phenomena in solids began more than 80 years ago, in the early 1920s. Approximately at the same time it was found that the scenario for breakdown depends critically on the magnitude of the ratio dV{sub}0/dt, where V{SUB}0 is the bias applied to the structure and t is time. Over a very wide range of magnitudes of dV{sub}0/dt from very small (quasi-static) to fairly large, just the same "conventional" scenario is followed, that usually known simply as "breakdown", but if dV{sub}0/dt becomes extremely large the picture changes dramatically to that termed "dynamic breakdown".
机译:固体分解现象的系统研究始于80年前,即1920年代初期。大约同时,发现击穿的情况主要取决于比率dV {sub} 0 / dt的大小,其中V {SUB} 0是施加到结构的偏压,t是时间。从非常小的(准静态)到相当大的dV {sub} 0 / dt幅度的很大范围内,都遵循相同的“常规”情况,通常简称为“击穿”,但如果dV { sub} 0 / dt变得非常大,画面急剧变化,称为“动态击穿”。

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