首页> 外国专利> Method for manufacturing semiconductor device for forming metal element-containing layer on insulating layer in which concave portion is formed, semiconductor device including insulating layer in which concave portion is formed, and semiconductor layer on insulating layer in which concave portion is formed

Method for manufacturing semiconductor device for forming metal element-containing layer on insulating layer in which concave portion is formed, semiconductor device including insulating layer in which concave portion is formed, and semiconductor layer on insulating layer in which concave portion is formed

机译:制造用于在其中形成有凹入部分的绝缘层上形成含金属元素的层的半导体器件的制造方法,包括其中形成有凹入部分的绝缘层和在其中形成有凹入部分的绝缘层上的半导体层的半导体器件

摘要

A method for manufacturing a semiconductor device for forming a metal element-containing layer on an insulating layer in which a concave portion is formed, includes: forming an oxide layer including mainly an oxide of the metal element on the insulating layer including the concave portion; and forming a silicate layer including mainly a silicate of the metal element by making the oxide layer into silicate by annealing under a reducing atmosphere.
机译:一种用于制造在其中形成有凹入部分的绝缘层上形成含金属元素的层的半导体器件的方法,该方法包括:在包括凹入部分的绝缘层上形成主要包含金属元素的氧化物的氧化物层;以及在包含凹入部分的绝缘层上形成金属层。通过在还原性气氛下进行退火使氧化物层成为硅酸盐,从而形成主要包含金属元素的硅酸盐的硅酸盐层。

著录项

  • 公开/公告号US9245847B2

    专利类型

  • 公开/公告日2016-01-26

    原文格式PDF

  • 申请/专利权人 TOKYO ELECTRON LIMITED;

    申请/专利号US201414510388

  • 申请日2014-10-09

  • 分类号H01L23/532;H01L21/02;H01L21/3105;H01L21/768;C23C16/06;C23C16/40;C23C16/455;C23C16/46;C23C16/50;H01L21/67;C23C16/04;C23C16/56;

  • 国家 US

  • 入库时间 2022-08-21 14:29:18

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号