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Biocompatible electroplated interconnection electronics package suitable for implantation
Biocompatible electroplated interconnection electronics package suitable for implantation
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机译:适合植入的生物相容性电镀互连电子封装
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摘要
Device is a hermetically sealed electronics package bonded to an electrode or flexible circuit that is suitable for implantation such as for a retinal or cortical electrode array. The hermetically sealed electronics package is bonded to the electrode or flexible circuit by electroplating a biocompatible material, such as platinum or gold, forming a plated connection, bonding the flexible circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation. The device comprises a substrate containing a contact, a flexible assembly containing a pad, and electroplated bonding between said contact and said pad that bonds said substrate and said flexible assembly together.
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