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Bonding pad for thermocompression bonding, process for producing a bonding pad and component
Bonding pad for thermocompression bonding, process for producing a bonding pad and component
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机译:用于热压结合的结合垫,制造结合垫的方法和组件
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摘要
A bonding pad for thermocompression bonding of a carrier material to a further carrier material includes a base layer and a top layer. The base layer is made of metal, is deformable, and is connected to the carrier material. The metal is nickel-based. The top layer is metallic and is connected directly to the base layer. The top layer is arranged at least on a side of the base layer which faces away from the carrier material. The top layer has a smaller layer thickness than the base layer. In at least one embodiment, the top layer has a greater oxidation resistance than the base layer.
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