首页> 外国专利> SIC EPITAXIAL WAFER, APPARATUS FOR PRODUCING SIC EPITAXIAL WAFER, METHOD FOR PRODUCING SIC EPITAXIAL WAFER, AND SEMICONDUCTOR DEVICE

SIC EPITAXIAL WAFER, APPARATUS FOR PRODUCING SIC EPITAXIAL WAFER, METHOD FOR PRODUCING SIC EPITAXIAL WAFER, AND SEMICONDUCTOR DEVICE

机译:SIC表晶晶片,用于制造SIC表晶晶片的设备,用于制造SIC表晶晶片的方法和半导体装置

摘要

This SiC epitaxial wafer (1) is provided with a substrate (2) and an SiC epitaxial growth layer (3) that is arranged on the substrate (2). The SiC epitaxial growth layer (3) uses an Si compound as an Si supply source and a C compound as a C supply source, and the Si compound and/or the C compound uses a compound containing fluorine (F) as a supply source thereof. In this connection, the Si compound is generally represented by SinHxClyFz (wherein n ≥ 1, x ≥ 0, y ≥ 0, z ≥ 1, and x + y + z = 2n + 2) and the C compound is represented by CmHqClrFs (wherein m ≥ 1, q ≥ 0, r ≥ 0, s ≥ 1 and q + r + s = 2m + 2). Provided are: a high quality SiC epitaxial wafer which has excellent film thickness uniformity and carrier concentration uniformity, while having less surface defects; an apparatus for producing an SiC epitaxial wafer; a method for producing an SiC epitaxial wafer; and a semiconductor device.
机译:该SiC外延晶片(1)具备基板(2)和配置在该基板(2)上的SiC外延生长层(3)。 SiC外延生长层(3)使用Si化合物作为Si供给源并且使用C化合物作为C供给源,并且Si化合物和/或C化合物使用包含氟(F)的化合物作为其供给源。 。就此而言,Si化合物通常由Si n H x Cl y F z 表示(其中n ≥1,x≥0,y≥0,z≥1,且x + y + z = 2n + 2),C化合物由C m H q Cl r F s (其中m≥1,q≥0,r≥0,s≥1,q + r + s = 2m + 2)。提供:一种高质量的SiC外延晶片,其具有优异的膜厚均匀性和载流子浓度均匀性,同时具有较少的表面缺陷;以及用于制造SiC外延晶片的设备; SiC外延晶片的制造方法;和半导体器件。

著录项

  • 公开/公告号WO2015186791A1

    专利类型

  • 公开/公告日2015-12-10

    原文格式PDF

  • 申请/专利权人 ROHM CO. LTD.;

    申请/专利号WO2015JP66208

  • 发明设计人 TAMURA KENTARO;

    申请日2015-06-04

  • 分类号H01L21/205;H01L21/28;H01L21/329;H01L21/336;H01L29/12;H01L29/41;H01L29/417;H01L29/423;H01L29/47;H01L29/49;H01L29/78;H01L29/872;

  • 国家 WO

  • 入库时间 2022-08-21 14:20:12

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