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SIC SEMICONDUCTOR ELEMENT IMPLEMENTED ON INSULATING OR SEMI-INSULATING SIC SUBSTRATE AND METHOD FOR MANUFACTURING SAME

机译:绝缘或半绝缘SIC基板上实现的SIC半导体元件及其制造方法

摘要

The present invention relates to a SiC semiconductor element having highly pressure-resistant characteristics and a method for manufacturing the same. The SiC semiconductor element according to the present invention comprises: an insulating or semi-insulating SiC substrate; a plurality of semiconductor areas formed inside the SiC substrate; and electrodes formed on the SiC substrate so as to electrically connect the plurality of semiconductor areas. The SiC element according to the present invention has high-density semiconductor areas formed in an insulating or semi-insulating SiC substrate, thereby exhibiting highly pressure-resistant characteristics, and can be implemented through an ion implantation process.
机译:具有高耐压特性的SiC半导体元件及其制造方法技术领域本发明涉及具有高耐压特性的SiC半导体元件及其制造方法。根据本发明的SiC半导体元件包括:绝缘或半绝缘的SiC衬底;以及绝缘的或半绝缘的SiC衬底。在SiC衬底的内部形成有多个半导体区域。电极形成在SiC衬底上,以电连接多个半导体区域。根据本发明的SiC元件具有在绝缘或半绝缘的SiC衬底中形成的高密度半导体区域,从而表现出高耐压特性,并且可以通过离子注入工艺来实现。

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