The present invention relates to an apparatus for transferring a damage-free ultra-thin substrate in a manufacturing process in a semiconductor and an etching apparatus. The present invention is to arrange a jig apparatus which is capable of a non-contact with a product of a ultra-thin and micro pattern and provides a direct damage-free semiconductor etching apparatus on a pattern surface when a product is transferred by means of the jig apparatus. The damage-free ultra-thin substrate transfer and etching apparatus comprises a roller driving apparatus which supports both ends, is in a three-column and O-ring structure, and transfers a non-contact jig apparatus; an etching oscillation nozzle frame; and an operation unit. The roller driving apparatus includes: the etching oscillation nozzle frame configured in upper and lower parts of the non-contact jig apparatus installed with the product in a symmetry structure, a connecting rod driving the same, a housing in a sealed structure, a cam driving rotation apparatus which performs a linear oscillating movement, and an etching chamber constituting a bevel gear motor axis apparatus. The etching oscillation nozzle frame is arranged in a symmetry arrangement of a pair which is composed of the upper and lower parts, each of which has six-column nozzle rods diagonally arranged and is configured at a regular interval, thereby configuring a pressure control apparatus so that horizontal oscillation and individual pressure control are possible. A product of less than or equal to 40 μm which has been a limit in a conventional manufacturing process can be directly processed in a non-contact scheme with a damage-free semiconductor etching apparatus, which has economical efficiency and practicality due to a reduced fault rate in a process, or the like.;COPYRIGHT KIPO 2016
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