CARRIER-EQUIPPED ULTRATHIN COPPER FOIL, AND COPPER-CLAD LAMINATE, PRINTED CIRCUIT SUBSTRATE AND CORELESS SUBSTRATE THAT ARE MANUFACTURED USING SAME

摘要

provides an ultra-thin copper foil, such as carrier adhesion can be easily adjusted of the carrier peel strength. Carrier attaching the ultra-thin copper foil 10 of the invention attached to the carrier foil 11 on, will the diffusion preventing layer 12, release layer 13 and the ultra-thin copper foil (16) formed by sequentially laminating, meaningful the carrier column stripped the carrier foil 11 from the ultra-thin copper foil (10), stripped in eojin carrier foil from the delaminated surface of the substrate 11, Auger electron spectroscopy (AES) depth direction composition analysis to have the time of, Cu, Co line by of, Mo, Ni, Fe, W, Cr, C, and O and when the denominator, the maximum value of the ratio of the Cu element present to a depth position within a 15 from the peeling surface, 9at.% ~91at.% It is characterized in that the. ;