CARRIER-EQUIPPED ULTRATHIN COPPER FOIL AND COPPER-CLAD LAMINATE PRINTED CIRCUIT SUBSTRATE AND CORELESS SUBSTRATE THAT ARE MANUFACTURED USING SAME

摘要

There is provided an ultra thin copper foil with a carrier which can easily adjust the carrier fill strength. The ultra-thin copper foil 10 with a carrier according to the present invention is formed by sequentially laminating a diffusion preventive layer 12, a release layer 13 and an ultra-thin copper foil 16 on a carrier foil 11, The carrier foil 11 is peeled off from the ultra-thin copper foil 10 and the depth direction composition of the carrier foil 11 peeled off is analyzed by the Auger electron spectroscopy (AES) , The maximum value of the element ratio of Cu existing from the release face to the depth position within 15 nm when Mo, Ni, Fe, W, Cr, C and O are denominators is 9 at.