The apparatus comprising: a first package connected to the second package, the first package and the second package each having a first side and an opposite second side; A first die coupled to the first package; And a second die connected to a second side of the second package, wherein the first package is connected to the second package in a stacked arrangement such that the first side of the second package faces the second side of the first package do. The method includes connecting a first package to a second package in a stacked configuration, wherein the first package includes a first package substrate and a first die, the second package includes a second package substrate and a second die, And the second die is disposed on the side of the second package substrate opposite the first package substrate.
展开▼
