首页> 外国专利> METHOD FOR MANUFACTURING HETEROJUNCTION FIN STRUCTURE, SEMICONDUCTOR DEVICE HAVING HETEROJUNCTION FIN STRUCTURE, METHOD FOR MANUFACTURING FIN-HFET BASED ON HETEROJUNCTION FIN STRUCTURE, AND FIN-HFET BASED ON HETEROJUNCTION FIN STRUCTURE

METHOD FOR MANUFACTURING HETEROJUNCTION FIN STRUCTURE, SEMICONDUCTOR DEVICE HAVING HETEROJUNCTION FIN STRUCTURE, METHOD FOR MANUFACTURING FIN-HFET BASED ON HETEROJUNCTION FIN STRUCTURE, AND FIN-HFET BASED ON HETEROJUNCTION FIN STRUCTURE

机译:制造异质结鳍片结构的方法,具有异质结鳍片结构的半导体器件,基于异质结鳍片结构的制造Fin-HFET的方法以及基于异质结鳍片结构的fin-HFET

摘要

The present invention is to disclose a method for manufacturing a heterojunction fin structure, a heterojunction fin structure, a method for manufacturing a fin-HFET based on a heterojunction fin structure, and a fin-HFET based on a heterojunction fin structure. The method for manufacturing a heterojunction fin structure comprises: sequentially laminating a first GaN layer, a first AlGaN layer, and a masking layer; forming an AlGaN fin structure by performing side etching on a partial area of the GaN layer, the first AlGaN layer, and the masking layer laminated sequentially; forming an etching barrier around the AlGaN fin structure and performing vertical etching on a part of the AlGaN fin structure; regrowing a second GaN layer and a second AlGaN layer for forming a heterojunction fin structure in the vertically etched area; and removing the etching barrier. Accordingly, it is possible to manufacture a heterojunction fin structure.;COPYRIGHT KIPO 2016
机译:本发明公开了一种异质结鳍结构的制造方法,异质结鳍结构,基于异质结鳍结构的鳍HFET的制造方法以及基于异质结鳍结构的鳍HFET。用于制造异质结鳍结构的方法包括:顺序地层叠第一GaN层,第一AlGaN层和掩模层;以及将第一GaN层,第一AlGaN层和掩模层依次层叠。通过在依次层叠的GaN层,第一AlGaN层和掩模层的部分区域上进行侧蚀刻来形成AlGaN鳍结构;在AlGaN鳍片结构周围形成刻蚀阻挡层,并对AlGaN鳍片结构的一部分进行垂直刻蚀;在垂直蚀刻区域中再生长第二GaN层和第二AlGaN层以形成异质结鳍结构。并去除蚀刻阻挡层。因此,可以制造异质结鳍片结构。; COPYRIGHT KIPO 2016

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