FINE PITCH SOLDER PASTE PRINTING METHOD USING A SQUEEGEE DEVICE AND IT

摘要

The present invention relates to a fine pitch squeegee device and a solder paste printing method using the same. The fine pitch squeegee device comprises: a squeegee (10) to print solder paste (S) on a pattern of a printed circuit board (P) positioned underneath a metal mask (M) while moving along an upper surface of the metal mask (M) in a slope of a prescribed angle; and a squeegee head (20) to support the squeegee (10). At least one vibration unit (100) is mounted on the inside or the outside of the squeegee head (20) to vertically vibrate and press the solder paste (S) rotating and moving on a front side of the squeegee (10) to fill fine holes (H) formed at fine pitch intervals of the metal mask (M) with the solder paste (S) without an empty space when the squeegee head (20) vertically vibrates on a Y-axis based on a horizontal plane of an upper portion of the metal mask (M) to linearly move the squeegee (10) on the metal mask (M). The solder paste is evenly filled and fed in the holes on the metal mask to accurately print according to the pattern of the printed circuit board to minimize a printing defect and improve a mounting density of electronic parts to improve productivity and reduce production costs.