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ENHANCEMENT MODE GaN HEMT DEVICE AND METHOD FOR FABRICATING THE SAME

机译:增强模式GaN HEMT器件及其制造方法

摘要

Incremental GaN transistor and method of forming the same. The enhancement type GaN transistor includes a substrate, a transition layer, a buffer layer composed of a III nitride material, a barrier layer composed of a III nitride material, a gate contact and a source contact, a gate III-V compound containing an acceptor dopant element, Wherein the gate III-V compound and the gate metal are formed and self-aligned by a single photomask process, and the lower portion of the gate metal and the upper portion of the gate compound have the same dimensions. In addition, the enhancement type GaN transistor may have a field plate formed of an ohmic metal, and the drain ohmic metal, the source ohmic metal, and the field plate are formed by a single photomask process.;
机译:增量式GaN晶体管及其形成方法。增强型GaN晶体管包括衬底,过渡层,由III族氮化物材料构成的缓冲层,由III族氮化物材料构成的势垒层,栅极接触和源极接触,包含受主的栅极III-V化合物。掺杂元素,其中栅极III-V化合物和栅极金属通过单个光掩模工艺形成并自对准,并且栅极金属的下部和栅极化合物的上部具有相同的尺寸。另外,增强型GaN晶体管可以具有由欧姆金属形成的场板,并且通过单个光掩模工艺形成漏极欧姆金属,源极欧姆金属和场板。

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