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SUBSTRATE PROCESSING APPARATUS SUBSTRATE TRANSFER METHOD ABNORMAL TREATMENT UNIT DETERMINING METHOD AND COMPUTER STORAGE MEDIUM

机译:底物处理设备底物转移方法异常处理单元确定方法和计算机存储介质

摘要

The presence or absence of abnormality of the processing section is judged in real time, and a large number of rejected wafers are prevented from being produced. The coating and developing apparatus includes a wafer transport mechanism, a defect inspection portion, a transport control means (200) for controlling the transport of the wafer, defect classification means (203) for classifying the defect based on the defect state, A storage means 202 for storing the wafer transfer route by the wafer transfer mechanism when the wafer is processed by the defect sorting means 203 and the type of defect classified by the defect sorting means 203, And a defect processing specifying means for determining the presence or absence of an abnormality in a processing section specified as having occurred a defect, wherein the defect management processing means The control unit 200 controls the wafer transfer mechanism to transfer the wafer by bypassing the processing unit determined to be abnormal by the defect processing specifying means 204. [
机译:实时判断是否存在处理部的异常,并防止产生大量不合格的晶片。该涂布显影装置包括:晶片输送机构;缺陷检查部;用于控制晶片的输送的输送控制单元(200);用于根据缺陷状态对缺陷进行分类的缺陷分类单元(203);以及存储单元。 202是用于存储由缺陷分类装置203对晶片进行处理时的,由晶片输送机构进行的晶片输送路径,以及由缺陷分类装置203进行分类的缺陷的种类,以及用于确定是否存在缺陷的缺陷处理确定装置的装置。其中,缺陷管理处理装置控制单元200通过绕过由缺陷处理指定装置204确定为异常的处理单元来控制晶片传送机构以传送晶片。

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