COPPER FOIL WITH CARRIER METHOD FOR MANUFACTURING COPPER FOIL WITH CARRIER COPPER FOIL WITH CARRIER FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

摘要

Wherein the average diameter D1 of the particle origin at 10% of the particle length is 0.2 mu m to 1.0 mu m and the ratio of the particle diameter L1 to the average diameter D1 of the particle source L1 / D1) of the copper foil is 15 or less. Wherein the sum of the areas occupied by the holes of the resin roughened surface having unevenness on the surface of the resin after the copper layer for printed wiring having the roughening treatment layer and the resin are laminated and the copper layer is removed by etching is 20% Copper foil for wiring boards. A copper foil for a semiconductor package substrate which avoids the above-mentioned circuit erosion phenomenon without deteriorating various other characteristics of the copper foil. In particular, it is an object of the present invention to provide a copper foil for a printed wiring board and a method of manufacturing the copper foil, which can improve the coarsened layer of the copper foil and increase the bonding strength between the copper foil and the resin.