首页> 外国专利> Conductive connection of the laser signal conductor tracks, which is introduced with pastes, metallized pads on aln substrates

Conductive connection of the laser signal conductor tracks, which is introduced with pastes, metallized pads on aln substrates

机译:激光信号导体走线的导电连接,在铝基板上以糊剂,金属化焊盘引入

摘要

The present invention relates to a process for the deposition of metallic coatings on ceramic substrates (1), wherein the metallic coatings comprise pads (2) and signal conductor tracks (3) and the pads (2) a greater thickness than the signal conductor tracks (3), and in at least one process step with the metallizations are applied by screen printing process is known per seThus economical pads (2) with a large thickness and signal conductor tracks (3) with a small thickness on a ceramic substrate (1) can be applied, the following process steps are proposed to be carried out in series:a. the use of a ceramic substrate (1) made of aluminum nitride (aln),example, printing of the pads (2) with the screen printing process using a screen with one or more printing operations,c. introduction of the signal conductor tracks (3) with a laser, wherein the laser beam along the signal conductor tracks (3) to be created on the ceramic substrate (1) is deflected and extends through the heat of the laser beam at the location of incidence of the laser beam on the substrate (1) the aluminum nitride of the substrate (1) which converts into the electrically conductive aluminum,that at the same time as or after the process step c steering of the laser beam on the connecting region (4) between the pads (2) and the signal conductor tracks (3) for the creation of an electrically conductive connecting region (4), which the signal conductor tracks (3) with the pads (4) and electrically conductively connectse, optionally, a galvanic application of a metal coating on the pads (2) and the signal conductor tracks (3).
机译:本发明涉及一种在陶瓷基片(1)上沉积金属涂层的方法,其中金属涂层包括焊盘(2)和信号导体迹线(3),并且焊盘(2)的厚度大于信号导体迹线的厚度。 (3),并且在至少一个通过丝网印刷工艺进行镀金属的工艺步骤中本身是已知的,因此,在陶瓷基板(1)上具有较大厚度的经济型焊盘(2)和具有较小厚度的信号导体线(3) )可以应用,建议以下过程步骤串联进行:a。使用由氮化铝(aln)制成的陶瓷基板(1),例如,使用具有一个或多个印刷操作的丝网通过丝网印刷工艺对焊盘(2)进行印刷; c。用激光引入信号导体迹线(3),其中沿着将在陶瓷衬底(1)上产生的信号导体迹线(3)的激光束被偏转并在激光束的位置处通过激光束的热量传播。激光束在衬底(1)上的入射,衬底(1)的氮化铝转化为导电铝,在加工步骤c的同时或之后将激光束转向连接区域( 4)在焊盘(2)和信号导体轨道(3)之间,用于建立导电连接区域(4),信号导体轨道(3)与焊盘(4)之间形成导电连接区域(4),并且导电地连接。在焊盘(2)和信号导线(3)上电镀金属涂层。

著录项

  • 公开/公告号DE102016200098A1

    专利类型

  • 公开/公告日2016-07-14

    原文格式PDF

  • 申请/专利权人 CERAMTEC GMBH;

    申请/专利号DE201610200098

  • 发明设计人 FELIX SCHWARZE;

    申请日2016-01-07

  • 分类号H05K3/10;H05K3/12;H05K1/11;B23K26/354;H01L23/15;

  • 国家 DE

  • 入库时间 2022-08-21 14:09:11

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