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METAL FLOATING GATE COMPOSITE 3D NAND MEMORY DEVICES AND ASSOCIATED METHODS

机译:金属浮栅复合3D NAND存储器设备和相关方法

摘要

A 3D NAND memory structure having improved process margin and enhanced performance is provided. Such a memory structure can include a control gate material and a floating gate material disposed between a first insulating layer and a second insulating layer, a metal layer disposed between the control gate material and the floating gate material, an interpoly dielectric (IPD) layer disposed between the metal layer and the control gate material such that the IPD layer electrically isolates the control gate material from the floating gate material, and a tunnel dielectric material coupled to the floating gate material opposite the control gate material.
机译:提供了具有改善的工艺裕度和增强的性能的3D NAND存储器结构。这样的存储器结构可以包括设置在第一绝缘层和第二绝缘层之间的控制栅极材料和浮置栅极材料,设置在控制栅极材料和浮置栅极材料之间的金属层,设置的多晶硅层间电介质(IPD)层在金属层和控制栅极材料之间形成一个介电层,使得IPD层将控制栅极材料与浮置栅极材料电隔离,并且将隧道介电材料电隔离到与控制栅极材料相对的浮置栅极材料。

著录项

  • 公开/公告号EP3084829A4

    专利类型

  • 公开/公告日2017-08-02

    原文格式PDF

  • 申请/专利权人 INTEL CORPORATION;

    申请/专利号EP20140870864

  • 发明设计人 SIMSEK-EGE FATMA A.;RAMASWAMY NIRMAL;

    申请日2014-11-17

  • 分类号H01L29/788;H01L21/28;H01L27/11524;H01L27/11556;

  • 国家 EP

  • 入库时间 2022-08-21 14:06:11

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