This invention relates to an electrolyte as well as a method for the deposition of a gold-copper alloy on a substrate surface. With the electrolyte and method disclosed, deposition of gold-copper alloys with a value of carat in the range of 12 to 19 kt is possible. Beneath a source of gold and copper, the inventive electrolyte comprises potassium cyanate (KCN) in a concentration capable to maintain a copper to KCN ratio in the range of 3 to 7, and at least one complexing agent of the group consisting of ethylenediamine tetraacetic acid, diethylenetriamine pentaacetic acid, nitrilo-triacetic acid, ethylenediamine tetraacetic acid [EDTA], diethylenetriamine pentaacetic acid and nitrilo-triacetic acid [NTA] Hydroxyethyl imino diacetic acid [HEIDA], nitrilo propionic diacetic acid [NPDA], imino diacetic acid [IDA], nitrilo trimethylphosphoric acid [NTMA, Dequest 2000], triethanol amine [TEA].
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