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HYBRID SYSTEM INTEGRATING PACKAGE-ON-PACKAGE SOC AND EMBEDDED MULTI-CHIP PACKAGE ON ONE MAIN CIRCUIT BOARD
HYBRID SYSTEM INTEGRATING PACKAGE-ON-PACKAGE SOC AND EMBEDDED MULTI-CHIP PACKAGE ON ONE MAIN CIRCUIT BOARD
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机译:集成在一个主电路板上的封装式封装SOC和嵌入式多芯片封装的混合系统
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摘要
A hybrid system includes a printed circuit board (PCB) having a main surface, a package-on-package (PoP) having a bottom package mounted on the main surface of the PCB and a top package stacked on the bottom package, and a multi-chip package (MCP) on the main surface of the PCB. The bottom package includes a system-on-chip (SoC) and the top package includes at least one on-package dynamic random access memory (DRAM) die accessible to the SoC. The MCP includes at least one on-board DRAM die accessible to the SoC via a PCB trace.
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