BALL GRID ARRAY PACKAGES INCLUDING A HEXAGONAL BALL ARRAY

摘要

A ball grid array (BGA) (100a) for an integrated circuit package (1) includes an array of connection points (502) derived from a base unit of hexagonal pattern repeated in at least one or more sections of the integrated circuit package (1), increasing the density of the connection points (502) and providing higher escape routing. According to one embodiment, the connection points (502) are solder balls (50) mounted on a lower surface of the integrated circuit package (1). The ball grid array (100a) may contain the hexagonal array in a second region (102) and an array of connection points (501) arranged in a square grid-shaped or a rectangular pattern in a first region (101), wherein the connection point pitches in the first and second regions (101, 102) may be the same or different. The teaching is applicable to all types of packages which include a BGA, including a chip scale package (CSP) BGA, a ceramic BGA (CBGA), a land grid array (LGA) package, fan-out packages or package-on-package (PoP).