Thermally conductive readily deformable aggregate, thermally conductive resin composition, thermally conductive member, and thermally conductive adhesive sheet

摘要

PROBLEM TO BE SOLVED: To provide a heat conductivity imparting material which can impart a heat conductivity comparable with those attained by conventional materials in a smaller use amount or impart a higher heat conductivity in a use amount comparable with those for conventional materials.SOLUTION: A easily deformable aggregate (D) comprises 100 pts. wt. of spherical heat conductive particles (A) having an average primary particle size of 0.1-10 μm, a non-spherical carbon material (J) and 0.1-30 pts. wt. of an organic binder (B) and has an average particle size of 2-100 μm and an average compression force necessary for the 10% compression deformation rate of 5 mN or smaller.