Easily deformable aggregate and method for manufacturing same, thermally conductive resin composition, thermally conductive member and method for manufacturing same, and thermally conductive adhesive sheet

摘要

An object of the present invention is to provide a thermal conductivity-giving material capable of giving substantially the same level of a thermal conductivity as that of the conventional material by using a smaller amount thereof than that conventionally used or giving a higher thermal conductivity than that of the conventional material by using substantially the same amount thereof as that conventionally used. The aforementioned problem can be solved by an easily deformable aggregate (D) comprising 100 pts·mass of thermally conductive particles (A) having an average primary particle diameter of 0.1 to 10 μm, and 0.1 to 30 pts·mass of an organic binding agent (B), in which the easily deformable aggregate (D) has an average particle diameter of 2 to 100 μm, and an average compressive force required for a 10% compressive deformation rate is 5 mN or lower.