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Printed board, printed board manufacturing method and printed board designing program

机译:印制板,印制板的制造方法和印制板设计程序

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board which prevents deterioration in waveform quality in a transmission line in the case where semiconductor elements having similar shapes are mounted on both surfaces of a substrate.SOLUTION: A printed circuit board comprises: a substrate; a first semiconductor element mounted on a first surface of the substrate; and a second semiconductor element which is mounted on a second surface of the substrate opposite to the first surface and has a shape similar to that of the first semiconductor element. Positions of a first side of the first semiconductor element and a first side of the second semiconductor element approximately correspond to each other on the substrate. A position of a second side of the first semiconductor element opposite to the first side and a position of a second side of the second semiconductor element opposite to the first side lie away from each other on the substrate.
机译:解决的问题:提供一种印刷电路板,该印刷电路板在具有相似形状的半导体元件安装在基板的两个表面上的情况下防止传输线的波形质量下降。第一半导体元件,其安装在所述基板的第一表面上;第二半导体元件,其安装在基板的与第一表面相反的第二表面上,并且具有与第一半导体元件相似的形状。第一半导体元件的第一侧和第二半导体元件的第一侧的位置在基板上大致彼此对应。第一半导体元件的与第一侧相反的第二侧的位置和第二半导体元件的与第一侧相反的第二侧的位置在基板上彼此远离。

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