Resin composition, and adhesive film, coverlay film, and interlayer adhesive formed thereby

摘要

Provided are: a resin composition that can be thermally cured at 180°C or lower, the resin composition having excellent adhesive strength to substrate materials, electrical properties in the high-frequency region of a frequency of 1 GHz or higher, specifically, a low dielectric constant () and a low dielectric loss tangent (tan ) in the region of a frequency of 1 GHz or higher, as well as little shrinkage stress during thermal curing; and an adhesive film and a coverlay film produced using this resin composition. This resin composition includes (A) a vinyl compound indicated by general formula (1), (B) a polystyrene-poly(ethylene/butylene) block copolymer having a styrene content of 25-40%, (D) an epoxy resin, (E) bismaleimide, and (F) an organic peroxide having an exothermic peak measured by differential scanning calorimetry (DSC) of 100-180°C, the mass ratio of each component being (A + E)/(B + C) = 0.81-1.00, (B)/(C) = 1.00-4.00, and the resin composition containing 1-10 mass% of component (D) by mass percent in relation to the total mass of components (A)-(F) and 0.1-10 mass% of component (F) by mass percent in relation to the content of component (A).