RESIN COMPOSITION AND ADHESIVE FILM COVERLAY FILM AND INTERLAYER ADHESIVE USING RESIN COMPOSITION

摘要

In addition to having excellent adhesion strength to the substrate material and exhibiting electrical properties in a high frequency region of 1 GHz or higher frequency, specifically, exhibiting low dielectric constant (ε) and low dielectric loss tangent (tanδ) in a region of frequency 1 GHz or higher, heat curing Provided is a resin composition having a low shrinkage stress at the time and being heat-curable at 180 or less, and an adhesive film produced using the resin composition, and a coverlay film. The resin composition of the present invention includes (A) a vinyl compound represented by the following general formula (1), (B) a polystyrene-poly(ethylene/butylene) block copolymer having a styrene content of 15 to 35% by mass, (C) Exothermic peak by polystyrene-poly(ethylene-ethylene/propylene) block copolymer with styrene content of 25 to 40 mass%, (D) epoxy resin, (E) bismaleimide, (F) differential scanning calorimetry (DSC) measurement Contains 100% or more and 180°C or less of organic peroxide, and the mass ratio of each component is (A+E)/(B+C)=0.81 or more and 1.00 or less, (B)/(C)=1.00 or more and 4.00 or less, As a mass percentage of the total mass of the components (A) to (F), the component (D) contains 1 to 10 mass%, and the mass percentage of the content of the component (A) is the component (F) It contains 0.1 to 10% by mass.