Resin composition, and adhesive film, coverlay film, and interlayer adhesive formed thereby

摘要

It has excellent adhesion strength to the substrate material and has electrical characteristics in a high frequency region with a frequency of 1 GHz or more, specifically, a low dielectric constant (ε) and a low dielectric loss tangent ( In addition to exhibiting tan δ), a resin composition that has a low shrinkage stress at the time of thermosetting and can be thermoset at 180 ° C. or less, and an adhesive film and a cover that are produced using the resin composition Provide lay film. The resin composition of the present invention comprises (A) a vinyl compound represented by the following general formula (1), (B) a polystyrene-poly (ethylene / butylene) block copolymer having a styrene content of 15 to 35%, (C ) Polystyrene-poly (ethylene-ethylene / propylene) block copolymer having a styrene content of 25-40%, (D) epoxy resin, (E) bismaleimide, (F) Exothermic peak by differential scanning calorimetry (DSC) measurement Includes an organic peroxide at 100 ° C. or higher and 180 ° C. or lower, and the mass ratio of each component is (A + E) / (B + C) = 0.81 or higher and 1.00 or lower, (B) / (C) = 1.00 It is 4.00 or less, is a mass percentage with respect to the total mass of the components (A) to (F), contains 1 to 10 mass% of the component (D), and is a mass percentage with respect to the content of the component (A). so, Serial component (F) containing 0.1 to 10 mass%.