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Collective board

机译:集体董事会

摘要

PROBLEM TO BE SOLVED: To miniaturize an electronic control device by reducing the influence of heat between circuit boards.;SOLUTION: In an electronic control device 1, a first circuit board 10 and a second circuit board 11 are arranged in a housing case 2 so as to vertically and partially overlap each other. A heat shielding plate 15 is extended in that region of the housing case 2 where the two circuit boards 10 and 11 overlap each other. With the heat shielding plate 15, heat generated by an electronic component 33 of the first circuit board 10 on the lower side is prevented from being directly transferred to the second circuit board 11. Since an arrangement interval between the two circuit boards 10 and 11 can be reduced, the electronic control device 1 can be miniaturized.;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:为了通过减小​​电路板之间的热量的影响来使电子控制装置小型化;解决方案:在电子控制装置1中,第一电路板10和第二电路板11布置在壳体2中。彼此垂直和部分重叠。隔热板15在壳体2的两个电路板10和11彼此重叠的区域中延伸。利用隔热板15,防止了由下侧的第一电路板10的电子部件33产生的热量直接传递到第二电路板11。因为可以在两个电路板10和11之间设置间隔。减少电子控制装置1的体积。;版权所有:(C)2014,日本特许经营&INPIT

著录项

  • 公开/公告号JP6053452B2

    专利类型

  • 公开/公告日2016-12-27

    原文格式PDF

  • 申请/专利权人 株式会社ケーヒン;

    申请/专利号JP20120236814

  • 发明设计人 佐脇 敬法;三浦 浩二;

    申请日2012-10-26

  • 分类号H05K7/20;

  • 国家 JP

  • 入库时间 2022-08-21 13:53:14

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