首页> 外国专利> SILICON CARBIDE SEMICONDUCTOR SWITCHING DEVICE AND METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR SWITCHING DEVICE

SILICON CARBIDE SEMICONDUCTOR SWITCHING DEVICE AND METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR SWITCHING DEVICE

机译:碳化硅半导体开关装置和制造碳化硅半导体开关装置的方法

摘要

A silicon carbide semiconductor switching device having a planar metal oxide semiconductor insulated gate structure. The silicon carbide semiconductor switching device includes a silicon carbide semiconductor substrate having a bandgap wider than that of silicon, a drift layer formed on the silicon carbide semiconductor substrate, a base region selectively formed in the drift layer at a top surface thereof, a source contact region selectively formed in the base region at a top surface thereof, a trench formed in the drift layer at the top surface thereof, the trench having a depth that is shallower than a depth of the source contact region, a gate electrode embedded in the trench, a top surface of the gate electrode being substantially flush with a top surface of the source contact region, and an interlayer insulating film formed on the top surfaces of the source contact region and the gate electrode.
机译:具有平面金属氧化物半导体绝缘栅结构的碳化硅半导体开关器件。碳化硅半导体开关装置包括:具有比硅的带隙宽的带隙的碳化硅半导体衬底;在碳化硅半导体衬底上形成的漂移层;在漂移层的顶表面上选择性地形成在漂移层中的基极区;源极触点。选择性地在其顶部表面的基极区域中形成的区域,在其顶部表面的漂移层中形成的沟槽,具有比源极接触区域的深度浅的深度的沟槽,埋入沟槽中的栅电极栅电极的顶面与源极接触区的顶面基本齐平,层间绝缘膜形成在源极接触区和栅电极的顶面上。

著录项

  • 公开/公告号US2017200788A1

    专利类型

  • 公开/公告日2017-07-13

    原文格式PDF

  • 申请/专利权人 FUJI ELECTRIC CO. LTD.;

    申请/专利号US201715468819

  • 发明设计人 MASAHIDE GOTOH;

    申请日2017-03-24

  • 分类号H01L29/16;H01L29/66;H01L29/78;H01L29/10;H01L29/423;

  • 国家 US

  • 入库时间 2022-08-21 13:52:33

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