THIN FILM RESISTIVE DEVICE FOR USE IN AN INTEGRATED CIRCUIT, AN INTEGRATED CIRCUIT INCLUDING A THIN FILM RESISTIVE DEVICE

摘要

Thin film resistive sensors typically include a number of resistive components. These components should be well matched in order for the sensor to provide accurate readings. When a sensor is incorporated within an integrated circuit, the resistive components may be formed over, or under, metallic traces that form part of other components. As a result, the thin film resistive components are subjected to different levels of stress. This disclosure provides a structure that is arranged to mitigate the effects of stress.