Electromagnetic interference shielding for system-in-package technology

摘要

Embodiments are generally directed to electromagnetic interference shielding for system-in-package technology. An embodiment of a system-in-package includes a substrate; chips and components attached to the substrate; dielectric molding over the chips and components; and an electromagnetic interference (EMI) shield. The EMI shield formed from a conductive paste, and the EMI shield provides a combined internal EMI shield between chips and components of the system in package and external EMI shield for the system-in-package.