How to Shield System-in-Package Assembly from Electromagnetic Interference

摘要

A method of shielding a system-in-package (SIP) assembly from electromagnetic interference (EMI) involves laminating a preform EMI shield film onto the assembly in a single laminating process. The EMI shield film can be formed in a vacuum laminating process to cover the SIP assembly and substantially fill the trenches formed in the assembly between adjacent component modules. Therefore, the SIP assembly is shielded from EMI by applying a single EMI shield film.