Methods for mold release of body-mountable devices including microelectronics

摘要

A body-mountable device may include a first polymer layer, a second polymer layer, and a structure that includes a sensor between the first and second polymer layers. Fabricating the body-mountable device may involve providing a respective surface layer on each of one or more molding pieces, forming a first polymer layer, positioning the structure on the first polymer layer and then forming, between molding pieces, the second polymer layer over the structure positioned on the first polymer layer. The surface layer of each molding piece may facilitate release of the polymer layer or fabricated body-mountable device without disruption to the embedded structure.