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Replacement gate FinFET process using a sit process to define source/drain regions, gate spacers and a gate cavity

机译:替代栅极FinFET工艺,采用坐姿工艺来定义源/漏区,栅极隔离层和栅极腔

摘要

A replacement gate FinFET manufacturing process in which the source/drain regions, gate structure and gate spacer are all defined by utilizing a single sidewall image transfer technique is provided. In the present application, the source/drain region (i.e., area) are defined by a mandrel structure, while the area for the functional gate structure are defined by the distance between spacers that are located on a pair of neighboring mandrel structures. The gate spacer is defined by the spacer present on the mandrel structures. In some embodiments, semiconductor fin erosion due to gate and gate spacer formation can be reduced or even eliminated.
机译:提供了替代栅极FinFET制造工艺,其中通过利用单侧壁图像转移技术来限定源极/漏极区域,栅极结构和栅极隔离物。在本申请中,源/漏区(即,面积)由心轴结构限定,而功能栅结构的面积由位于一对相邻心轴结构上的间隔物之间​​的距离限定。栅极隔离物由存在于心轴结构上的隔离物限定。在一些实施例中,可以减少甚至消除由于栅极和栅极间隔物的形成而引起的半导体鳍腐蚀。

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