首页> 外国专利> Differential SG/EG spacer integration with equivalent NFET/PFET spacer widths and dual raised source drain expitaxial silicon and triple-nitride spacer integration enabling high-voltage EG device on FDSOI

Differential SG/EG spacer integration with equivalent NFET/PFET spacer widths and dual raised source drain expitaxial silicon and triple-nitride spacer integration enabling high-voltage EG device on FDSOI

机译:具有等效NFET / PFET隔离宽度的差分SG / EG隔离集成,以及双凸起的源极漏极外延硅和三氮化物隔离集成,可在FDSOI上实现高压EG器件

摘要

A method of forming matched PFET/NFET spacers with differential widths for SG and EG structures and a method of forming differential width nitride spacers for SG NFET and SG PFET structures and PFET/NFET EG structures and respective resulting devices are provided. Embodiments include providing PFET SG and EG structures and NFET SG and EG structures; forming a first nitride layer over the substrate; forming an oxide liner; forming a second nitride layer on sidewalls of the PFET and NFET EG structures; removing horizontal portions of the first nitride layer and the oxide liner over the PFET SG and EG structures; forming RSD structures on opposite sides of each of the PFET SG and EG structures; removing horizontal portions of the first nitride layer and the oxide liner over the NFET SG and EG structures; and forming RSD structures on opposite sides of each of the NFET SG and EG structures.
机译:提供一种形成用于SG和EG结构的具有不同宽度的匹配的PFET / NFET间隔物的方法,以及形成用于SG NFET和SG PFET结构和PFET / NFET EG结构的差分宽度氮化物间隔物的方法以及相应的器件。实施例包括提供PFET SG和EG结构以及NFET SG和EG结构;在衬底上方形成第一氮化物层;形成氧化物衬里;在PFET和NFET EG结构的侧壁上形成第二氮化物层;去除PFET SG和EG结构上方的第一氮化物层和氧化物衬垫的水平部分;在每个PFET SG和EG结构的相对侧上形成RSD结构;去除NFET SG和EG结构上方的第一氮化物层和氧化物衬垫的水平部分;在每个NFET SG和EG结构的相对侧上形成RSD结构。

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