Water-soluble cutting fluid for slicing silicon ingots

摘要

A water-soluble cutting fluid for slicing silicon ingots is characterized in that it includes a monoprotic or diprotic aliphatic carboxylic acid (A) having a carbon number (including the carbon in the carbonyl group) of 4˜10, and either a polyprotic organic acid (B) with ΔpKa of 0.9˜2.3 as defined by the following formula (1) or a salt (BA) of said organic acid (B) as essential components:ΔpKa=(pKa₂)−(pKa₁)  (1)wherein the dissociation stage, at which the organic acid (B) denoted as n-protic acid H_nA, becomes H_n-1A+H⁺ is numbered 1 with an acid dissociation constant expressed as pKa₁, and the dissociation stage at which the organic acid (B) becomes H_n-2A+H⁺ is numbered as 2 with an acid dissociation constant expressed as pKa₂.