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Manufacture of wafer—panel die package assembly technology
Manufacture of wafer—panel die package assembly technology
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机译:晶圆制造-面板芯片封装组装技术
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摘要
Disclosed is a process, structure, equipment and apparatus directed to a low cost, high volume approach for the assembly of ultra small die to three-dimensional (3D) or 2.5D semiconductor packages.
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