首页>
外国专利>
Temporary adhesive material for wafer, film for temporary adhesion using same, wafer processing laminate, and method for producing thin wafer using same
Temporary adhesive material for wafer, film for temporary adhesion using same, wafer processing laminate, and method for producing thin wafer using same
展开▼
机译:晶圆临时粘合材料,使用该临时粘合材料的膜,晶圆加工层压板以及使用其制造薄晶圆的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A temporary adhesive material for a wafer includes a first temporary adhesive layer of a silicone-containing polymer layer containing a photo base generator and a second temporary adhesive layer of a silicone-containing polymer layer which is laminated on the first temporary adhesive layer, does not contain the photo base generator, and is different from the polymer layer. Thereby, there can be formed a temporary adhesive layer having high thickness uniformity, even on a wafer having a step. Because of the thickness uniformity, a thin wafer having a uniform thickness of 50 μm or less can be easily obtained. When a thin wafer is produced and then delaminated from a support, the wafer can be delaminated from the support by exposure at a low exposure dose without stress. Therefore, a brittle thin wafer can be easily handled without causing damage, and a thin wafer can be easily produced.
展开▼