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TEMPORARY ADHESIVE MATERIAL FOR WAFER, TEMPORARY ADHESIVE FILM USING THE SAME, AND WAFER PROCESSED ARTICLE, AND METHOD FOR MANUFACTURING THIN WAFER USING THE SAME
TEMPORARY ADHESIVE MATERIAL FOR WAFER, TEMPORARY ADHESIVE FILM USING THE SAME, AND WAFER PROCESSED ARTICLE, AND METHOD FOR MANUFACTURING THIN WAFER USING THE SAME
PROBLEM TO BE SOLVED: To provide a temporary adhesive material which facilitates temporary adhesion of a wafer to a support member and also enables formation of a temporary adhesive layer having high uniformity in thickness on a substrate with a difference in surface height, has high process adaptability to TSV formation and wafer underside wiring, facilitates peeling off a thin wafer from the support member and improves productivity, and a temporary adhesive film and a method for manufacturing thin wafer using them.SOLUTION: The inventive temporary adhesive layer enables formation of a temporary adhesive layer even on a wafer having a difference in surface height, and because of the uniformity in thickness, allows a uniform thin wafer having a thickness of 50 m or less to be obtained easily. Further, since it enables stress-free peeling off of a thin wafer from a support member after formation thereof with a little amount of exposure, fragile thin wafers can be easily handled without causing damage thereto, facilitating manufacture of a thin wafer.
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