ENCAPSULATION METHOD OF CSP LED AND CSP LED

摘要

An encapsulation method of a CSP LED comprises the following steps: disposing an LED chip on a carrier; covering light blocking glue or fluorescent glue on the LED chip; covering fluorescent glue on the light blocking glue or cutting between fluorescent glue to form trenches and filling the trenches with light blocking glue; finally, cutting to form a CSP LED with light blocking glue and fluorescent glue outside the chip. With the process of the invention, multiple one-side light emitting LEDs can be produced simultaneously, the procedures are simple and yellow light at the joint of the light blocking glue layer and the chip can be prevented. A CSP LED with the chip covered with encapsulation glue and the electrodes of the chip exposed and protruding is also disclosed. Disclosed also is a three-side light emitting CSP LED with light blocking glue disposed on two sides and fluorescent glue disposed on the other sides. The LED can be used in the fields of back light source, side light emitting lamp bar, and so on.