ENCAPSULATION METHOD OF CSP LED AND CSP LED

摘要

A method of packaging CSP LED, comprising the following steps: placing LED chips on a carrier plate; coating light-blocking glue or fluorescent glue on the LED chips; at last cutting to form CSP LEDs with coating light-blocking glue or fluorescent glue outside the chip. Multiple LEDs, from one surface of which light could be emitted, could be fabricated simultaneously by using the packaging process in present invention. The process is simple and able to prevent yellow light from appearing at the bonding surface of the light-blocking glue and the chip. The present invention also provides a CPS LED with the chip covered by packaging glue and the electrode of the chip protruding exposed and protruding. The present invention also provides CPS LEC, from three surfaces of which light could be emitted, with light-blocking glue arranged on two side surfaces and fluorescent glue arranged one other surfaces. This kind of LED could be used in various fields such as backlight and light bar, from side surfaces of which light could be emitted.