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Apparatus and methods of forming a conductive transparent oxide film layer for use in a cadmium telluride based thin film photovoltaic device

机译:形成用于碲化镉基薄膜光伏器件的导电透明氧化物膜层的设备和方法

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#$%^&*AU2011202979B820161117.pdf#####APPARATUS AND METHODS OF FORMING A CONDUCTIVE TRANSPARENT OXIDE FILM LAYER FOR USE IN A CADMIUM TELLURIDE BASED THIN FILM PHOTOVOLTAIC DEVICE ABSTRACT OF THE DISCLOSURE Methods for forming a TCO layer on a substrate are generally provided and include sputtering a TCO layer on a substrate from a target including cadmium stannate. A cap material (e.g., including cadmium) is deposited onto an outer surface of an indirect anneal system, and the TCO layer can be annealed at an anneal temperature while in contact with or within about 10 cm of the cap material. An anneal oven is also generally provided and includes an indirect anneal system defining a deposition surface and an anneal surface such that a cap material deposited on the anneal surface of the indirect anneal system is positioned to be in contact with or within about 10 cm of a thin film on the substrate. A cap material source can be positioned to deposit the cap material onto the deposition surface such that the anneal surface comprises the cap material.2/5 30 32 Forming a TCO layer on a glass substrate 34 Forming a resistive transparent layer on the TCO layer 36 Forming a cadmium sulfide layer on the resistive transparent layer 38 Forming a cadmium telluride layer on the cadmium sulfide layer 40 Annealing the cadmium telluride layer in the presence of cadmium chloride 42 Washing the surface of the cadmium telluride layer to remove oxides 44 Doping the cadmium telluride layer with copper 46 Applying back contact layer(s) over the cadmium telluride layer 48 Applying an encapsulating glass over the back contact layer(s) Fig. 2
机译:#$%^&* AU2011202979B820161117.pdf #####形成导体的装置和方法用于碲化镉的透明氧化物膜层基于薄膜的光电器件披露摘要通常提供在衬底上形成TCO层的方法,并且包括从包含镉的靶材在衬底上溅射TCO层锡酸盐将盖材料(例如,包括镉)沉积到外表面上间接退火系统,并且可以在退火时对TCO层进行退火与帽材料接触或在帽材料周围约10厘米之内的温度。通常还提供退火炉,并且包括间接退火。定义沉积表面和退火表面的系统,使得盖材料沉积在间接退火系统的退火表面上的金属与基材上的薄膜接触或在其附近10厘米之内。盖子材料可以定位源以将盖材料沉积到沉积表面上,例如退火表面包括盖材料。2/53032在其上形成TCO层玻璃基板34形成电阻透明层在TCO层上36形成硫化镉层在电阻透明层上38在其上形成碲化镉层硫化镉层40退火碲化镉镉存在下的镀层氯化物42清洗镉的表面碲化物层去除氧化物44掺杂碲化镉层带铜46在其上施加背接触层碲化镉层48在上面涂上密封玻璃背接触层图2

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