首页> 外国专利> LARGE-AREA VANADIUM OXIDE SEMICONDUCTOR THIN-FILM GROWTH TYPE PID CONTROL SPUTTERING SYSTEM

LARGE-AREA VANADIUM OXIDE SEMICONDUCTOR THIN-FILM GROWTH TYPE PID CONTROL SPUTTERING SYSTEM

机译:大面积氧化钒半导体薄膜生长型PID控制溅射系统

摘要

The present invention relates to a large-area VO2 semiconductor thin-film growth type PID control sputtering system comprising: a PID control type sputtering gun; a PID temperature control type thin-film growth heater; an ultrafine flow rate gas supply line; and a thin-film substrate. The system further comprises: a temperature sensor, coupled to one end of the sputtering gun, for measuring the temperature of the sputtering gun; a flow rate measurement sensor, coupled to one end of the sputtering gun, for detecting flow of a coolant in order to prevent heating of the sputtering gun; a valve, coupled to the other end of the sputtering gun, for controlling the flow of the coolant; and a digital drive circuit which receives a signal from the temperature sensor and the flow rate measurement sensor so as to control the sputtering gun and the valve. Accordingly, because of having a PID feedback structure, the quality of a VO2 thin-film is very stable in terms of growth conditions compared to high quality growth conditions and conventional methods. Further, compared to conventional technologies in which the quality of a thin-film having a particle-type structure and high density is inconsistently produced even under the same conditions, the present invention can secure the quality of a thin-film having a very highly reproducible structure. Therefore, by means of such a result, it is possible to have an effect of increasing the current density of a VO2 thin-film and also enabling the transition temperature variance to be consistent. In addition, it is expected that the effect of the present invention may be utilized for the purpose of achieving stability and reproducibility of a base apparatus by designing, in the form of an individual PID sensor, the base apparatus in apparatuses used in a conventional physical vapor deposition (PVD).
机译:大面积VO 2 半导体薄膜生长型PID控制溅射系统技术领域本发明涉及一种大面积VO 2 半导体薄膜生长型PID控制溅射系统。 PID温度控制型薄膜生长加热器;超细流量气体供应管线;和薄膜基板。该系统还包括:温度传感器,其耦合到溅射枪的一端,用于测量溅射枪的温度;以及流量测量传感器,连接到溅射枪的一端,用于检测冷却剂的流量,以防止溅射枪受热。阀,连接到溅射枪的另一端,用于控制冷却剂的流量;数字驱动电路,其接收来自温度传感器和流量测量传感器的信号,以控制溅射枪和阀。因此,由于具有PID反馈结构,所以与高质量生长条件和常规方法相比,VO 2 薄膜的质量在生长条件方面非常稳定。此外,与常规技术相比,即使在相同条件下也不能始终产生具有颗粒型结构和高密度的薄膜的质量,本发明可以确保具有非常高可再现性的薄膜的质量。结构体。因此,通过这种结果,可以具有增加VO 2 薄膜的电流密度的效果,并且还可以使转变温度变化一致。另外,期望通过以单独的PID传感器的形式设计在常规物理设备中使用的设备中的基本设备,可以将本发明的效果用于实现基本设备的稳定性和再现性的目的。气相沉积(PVD)。

著录项

  • 公开/公告号WO2017010592A1

    专利类型

  • 公开/公告日2017-01-19

    原文格式PDF

  • 申请/专利权人 TERALEADER.INC.;

    申请/专利号WO2015KR07386

  • 发明设计人 HAN SEOK-KILL;

    申请日2015-07-16

  • 分类号H01L21/203;H01L29/786;

  • 国家 WO

  • 入库时间 2022-08-21 13:32:39

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