OPC REVISING LAYOUT DESIGN THROUGH OPC TO REDUCE CORNER ROUNDING EFFECT

摘要

The present disclosure provides a method of manufacturing a semiconductor device. A first layout design for a semiconductor device is received. The first layout design includes a plurality of gate lines and an active region overlapping the gate lines. The active region includes at least one angled corner disposed adjacent to at least one of the gate lines. The first layout design for the semiconductor device is modified through an optical proximity correction (OPC) process to generate a second layout design that includes a quad active area having outwardly projecting quadrangular corners. Thereafter, the semiconductor device is fabricated based on the second layout design.