SPUTTERING TARGET STRUCTURE AND SPUTTERING TARGET STRUCTURE MANUFACTURING METHOD

摘要

Reduce particles. The sputtering target structure includes a sputtering target and a backing plate for holding the sputtering target. At least one of the surface of the sputtering target and the surface of the backing plate has a region including a plurality of recesses having an average diameter of 50 mu m or more and 300 mu m or less and an average depth of 5 mu m or more and 30 mu m or less. The arithmetic average roughness Ra of the surface of the region including the plurality of recesses is 10 占 퐉 or more and 20 占 퐉 or less.