BIDIRECTIONAL CONDUCTIVE PATTERN MODULE FOR SEMICONDUCTOR TEST AND SEMICONDUCTOR TEST SOCKET USING SAME

摘要

The present invention relates to a bidirectional conductive pattern module for semiconductor testing and a semiconductor test socket using the same. A bidirectional conductive pattern module according to the present invention comprises: an upper bracket made of an insulating material; a lower bracket made of an insulating material and spaced apart from the upper bracket in the vertical direction; an elastic connecting portion elastically connecting the upper bracket and the lower bracket in a state where the upper bracket and the lower bracket are spaced apart from each other in the vertical direction; a plurality of upper contact portions having conductivity and engaging with one side surface of the upper bracket so as to be spaced along the direction of the plate surface of the upper bracket; a plurality of lower contact portions having conductivity and engaging with one side surface of the lower bracket so as to be spaced along the direction of the plate surface of the lower bracket; and a plurality of conductive connecting portions electrically connecting the upper contact portions and the lower contact portions to each other. Therefore, the upper bracket and the lower bracket are formed independently of each other, and an upper contact pin and a lower contact pin are connected to each other through the conductive connecting portions to form a conductive pattern in the vertical direction. Thus, fine pitch can be realized, and it is possible to solve problems of existing technology which shortens life due to problems such as separation of conductive powder.;COPYRIGHT KIPO 2017