BIDIRECTIONAL CONDUCTIVE SOCKET FOR TESTING SEMICONDUCTOR DEVICE, BIDIRECTIONAL CONDUCTIVE MODULE FOR TESTING SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFOR

摘要

A bidirectional conductive module for testing a semiconductor device, according to one embodiment of the present invention, comprises: a substrate part having a structure bent such that one surface thereof faces the semiconductor device and another surface thereof faces an inspection circuit board; a plurality of terminal pins having a plurality of first conductive patterns linearly spaced apart from each other at a first pitch interval on the one surface of the substrate part so as to be electrically connected to respective terminals of the semiconductor device, and a plurality of second conductive patterns linearly spaced apart from each other at a second pitch interval greater than the first pitch interval on the other surface of the substrate part so as to be electrically connected to respective terminals of the inspection circuit board; and an elastic support part connected to the substrate part so as to elastically support the substrate part, wherein it is preferable for the plurality of terminal pins to be provided on the substrate part such that the plurality of first conductive patterns are arranged linearly while being spaced apart at the first pitch interval on the one surface of the substrate part, and the plurality of second conductive patterns are arranged in a zigzag form by being misaligned at the second pitch interval on the other surface of the substrate part, and thus the plurality of first conductive patterns come in contact with the terminals of the semiconductor device at the first pitch interval, and the plurality of second conductive patterns come in contact with the terminals of the inspection circuit board at the second pitch interval, such that the terminals of the semiconductor device and the terminals of the inspection circuit board are electrically connected.