首页> 外国专利> BIDIRECTIONAL CONDUCTIVE MODULE FOR SEMICONDUCTOR TEST, METHOD FOR MANUFACTURING BIDIRECTIONAL CONDUCTIVE MODULE FOR SEMICONDUCTOR TEST, AND SOCKET FOR SEMICONDUCTOR TEST

BIDIRECTIONAL CONDUCTIVE MODULE FOR SEMICONDUCTOR TEST, METHOD FOR MANUFACTURING BIDIRECTIONAL CONDUCTIVE MODULE FOR SEMICONDUCTOR TEST, AND SOCKET FOR SEMICONDUCTOR TEST

机译:用于半导体测试的双向导电模块,用于半导体测试的双向导电模块的制造方法以及用于半导体测试的插座

摘要

A bidirectional conductive module for a semiconductor test according to an embodiment of the present invention includes: a plurality of first conductive contact portions arranged in a row by being spaced apart from each other in a transverse direction, and in contact with terminals of a semiconductor element; a plurality of second conductive contact portions spaced below the first conductive contact portions, arranged in a row in a transverse direction at positions corresponding to the first conductive contact portions, and in contact with terminals of a test circuit board; a plurality of conductive connection portions connecting the first conductive contact portions and the second conductive contact portions in a longitudinal direction orthogonal to the transverse direction; and an insulating portion located between the conductive connection portions positioned adjacent to each other in the transverse direction, for blocking electrical connection between the conductive connection portions. The conductive connection portions comprise: a mesh having conductivity, and having upper and lower ends bent in the longitudinal direction so as to have elasticity; and a conductive block for elastically supporting the mesh. The mesh has the first conductive contact portions attached to the upper end thereof and the second conductive contact portions attached to the lower end thereof, and thus it is preferable that the first conductive contact portions and the corresponding second conductive contact portions are electrically connected respectively.;COPYRIGHT KIPO 2017
机译:根据本发明实施例的用于半导体测试的双向导电模块包括:多个第一导电接触部,其通过在横向方向上彼此间隔开而排成一排,并且与半导体元件的端子接触。 ;多个第二导电接触部,在第一导电接触部的下方隔开间隔,在与第一导电接触部相对应的位置沿横向排列成一列,并与测试电路基板的端子接触。在与横向正交的长度方向上连接第一导电接触部和第二导电接触部的多个导电连接部。绝缘部分位于沿横向方向彼此相邻的导电连接部分之间,用于阻挡导电连接部分之间的电连接。导电连接部包括:具有导电性的网状物,该网状物的上下两端在长度方向上弯曲而具有弹性。导电块,用于弹性地支撑网孔。该网具有附接到其上端的第一导电接触部分和附接到其下端的第二导电接触部分,因此优选地,第一导电接触部分和对应的第二导电接触部分分别电连接。 ; COPYRIGHT KIPO 2017

著录项

  • 公开/公告号KR101755553B1

    专利类型

  • 公开/公告日2017-07-10

    原文格式PDF

  • 申请/专利权人 INNO GLOBAL INC.;

    申请/专利号KR20160007359

  • 申请日2016-01-21

  • 分类号G01R1/04;G01R3;G01R31/28;

  • 国家 KR

  • 入库时间 2022-08-21 13:25:12

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