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NON-CYANIDE BASED Au-Sn ALLOY PLATING SOLUTION

机译:基于非氰化物的Au-Sn合金镀液

摘要

The present invention provides a non-cyanide-based Au-Sn alloy plating solution. The non-cyanide-based Au-Sn alloy plating solution can be treated with the Au-Sn alloy plating, by a plating solution composition, which is neutral and which does not include cyanide. The non-cyanide-based Au-Sn alloy plating solution of the present invention comprises: soluble gold salts of non-cyanide; a Sn compound including tetravalent Sn; and a thiocarboxylic acid-based compound. The non-cyanide-based Au-Sn alloy plating solution of the present invention additionally comprises sugar alcohols and dithioalkyl compounds.;COPYRIGHT KIPO 2017
机译:本发明提供了基于非氰化物的Au-Sn合金镀覆溶液。非氰化物类Au-Sn合金镀覆溶液可以通过Au-Sn合金镀覆,通过中性且不包含氰化物的镀覆溶液组合物进行处理。本发明的基于非氰化物的Au-Sn合金镀液包含:可溶性的非氰化物的金盐;和包含四价Sn的Sn化合物;和基于硫代羧酸的化合物。本发明的基于非氰化物的Au-Sn合金镀液还包含糖醇和二硫代烷基化合物。; COPYRIGHT KIPO 2017

著录项

  • 公开/公告号KR20170116958A

    专利类型

  • 公开/公告日2017-10-20

    原文格式PDF

  • 申请/专利权人 ELECTROPLATING ENGINEERS OF JAPAN LIMITED;

    申请/专利号KR20170044770

  • 发明设计人 HAYASHI KATSUNORIJP;

    申请日2017-04-06

  • 分类号C25D3/62;

  • 国家 KR

  • 入库时间 2022-08-21 13:26:27

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